Package 2--Three innovations in the history of packaging development

     Package 2--Three innovations in the history of packaging development

Three innovations in the history of packaging development

1. In the 1980s, a more space-saving surface mount package appeared, that is, SMT (surface mounting technology) packaging technology; its appearance greatly improved the component density on the printed circuit board, and it is also the most popular process in the industry . Contains (SOP package; PLCC package; QFP package)

2. In the 1990s, a more novel ball grid array package appeared, that is, the BGA package; it not only met the market's demand for pin height; it also greatly improved the performance of semiconductor devices;

3. After the 21st century, people have developed more sophisticated chip-level packaging WL-CSP chip-level packaging; SIP system-in-package and chip-level packaging CSP chip-level packaging; advanced technology minimizes the original packaging volume as much as possible.