Package 1-Package to install semiconductor integrated circuit chip

            Package to install semiconductor integrated circuit chip

1. Package

Refers to the integrated circuit bare chip produced by the factory, which is placed on a substrate that acts as a load bearing, the pins are drawn out, and then fixed and Packaged as a whole.

In layman's terms, like a mobile phone, the manufacturer encapsulates all the complicated internal details for the convenience of foreign trade. Only expose simple interfaces to us, such as charging sockets;

The packaging form refers to the housing used to install the semiconductor integrated circuit chip.

2. Why should integrated circuits be Packaged?

1. Isolate the air and protect the circuit (the chip material is silicon, which is easily oxidized into silicon dioxide when in contact with air; so it must be isolated from the outside world to prevent the impurities in the air from corroding the chip circuit and causing electrical performance to decline.

2. Easy to install and fix: Connect the contacts on the chip to the pins of the Package shell with wires, and these pins are connected to other devices through PCB (Print circuit board) and wires on the printed circuit board, so as to realize internal The connection between the chip and the external circuit.

3. The standards are standardized and easy to transport; because chips need to have uniform standards and specifications when they are mass-produced and sold, they are also easy to transport;

3. What functions should the Package have?

1. Electric energy conduction is essential (electricity can keep components running normally;

2. It has good signal transmission capability, which is also one of the functions of packaging.

3. Since the components will generate heat during operation, maintaining a good heat dissipation effect is also a very important function of the Package.

4. Finally, component packaging can maximize the protection of the internal structure of chip devices and prevent unnecessary losses caused by bumps.

4. Factors to consider when packaging

1. In order to improve packaging efficiency, the area ratio between the chip and the Package should be as close to 1:1 as possible

2. Short pins can reduce delay, and large pin spacing can reduce interference and improve performance;

3. The chip itself will generate heat when it runs at high speed. Based on the heat dissipation requirements, the thinner the Package, the better;

5. The development process of packaging

Metal Package = TO Package: in the 1960s: wafer bare chip, the bare chip is usually metal Package or TO Package;

Dual in-line Package = DIP Package: 1970s: more convenient dual in-line Package appeared, that is, DIP Package

After the 1980s, three major changes in chip packaging and their impact on the electronics industry.