Package 3--Evolution of Packaging - Structural Aspects

Package 3--Evolution of Packaging - Structural Aspects

1. The TO Package consists of a TO tube base and a TO tube cap; the TO tube base serves as the base of the packaged component and provides power to it; the tube cap can realize smooth optical signal transmission;

2. DIP Dual-in-line Package is also called DIP Package or DIP package. Its package shape is rectangular; on its two sides, there are two rows of parallel metal pins, called pin headers. DIP packaged components can be soldered into plated through-holes on printed circuit boards or inserted into DIP sockets

3. The form of LCC package is designed for non-pin chip package; this package adopts patch package, and its pins are bent inward at the edge of the chip; while sticking to the chip, it also reduces its installation volume.

4. The Chinese meaning of QFP technology is called square flat packaging technology. The distance between the CPU chip pins realized by this technology is very small, and the pins are very thin. Generally, large-scale or very large-scale integrated circuits adopt this packaging form. The number of pins is generally above 100.

BGA ball grid array packaging technology. At the bottom of the Package, the pins are ball-shaped and arranged in a grid-like pattern, hence the name BGA; motherboard control chipsets mostly use this type of packaging technology. The material is mostly ceramic; the memory packaged with this technology can increase the memory capacity by two to three times while maintaining the same volume.

6. CSP refers to the chip size package, the Package size is basically the same as the core size of the chip, and the ratio of the core area to the Package area is about 1:1:1

7. MCM multi-chip component is a package that assembles multiple semiconductor bare chips on a wiring substrate. According to the substrate material, it can be divided into three categories: MCM-L, MCM-C and MCM-D