Pakcage5-Packaging classified by chip sealing or packaging

Package 5- classified by chip sealing or packaging

1. Hermetic packaging and resin packaging: The packaging or sealing methods of bare chips and their electrodes and leads can be divided into two categories: hermetic packaging and resin packaging; and hermetic packaging can be divided into metal packaging according to different packaging materials. package, ceramic package, glass package,

2. Why choose hermetic packaging and resin packaging? This is due to the extremely small spacing between the chips, which easily builds up a strong electric field between the conductors. Corrosion of dissimilar metals can occur if water vapor intrudes. In order to protect the internal circuit, the device should be separated from the outside world with air-tight and waterproof materials. In hermetic packaging, why should metal, ceramic and glass be used? This is because no material is truly sealed against water vapor, and metals, ceramics, and glass have very low permeability to water vapor. Several orders of magnitude lower than plastic.

Packaging - Classification by packaging material

1. Metal material: The advantages are: high packaging precision, strict size, easy to mass production, and low price.

2. Ceramic materials: the advantages are: excellent electrical performance, suitable for high-density packaging

3. Metal-ceramic Package: It has the advantages of both metal package and ceramic Package,

4. Plastic material: Plastic has strong plasticity, low cost, simple process and suitable for mass production.