appearance of the diode packaging, which is divided into a frame and a flattened one

What is the difference between the appearance of the diode packaging, which is divided into a frame and a flattened one?

1、 The positioning of the diode frame process product chip is precise, and the processes of soldering, mounting, and soldering are all completed in an instant; It can solder 1.9 chips in one second, with a very short time; The yield rate can reach 100%.

2、diode flattening process products should be completed by installing lead wires, chip welding, covering lead wires, pressing into the furnace for 45 minutes and sintering. Errors in any link or human factors will lead to Product defect defects or failures; The surface of the chip is easily scratched, which can lead to excessive leakage current; The yield rate reaches 98% -99%.