The similarity between diode SMA and SMAF packaging

The similarity between diode SMA and SMAF packaging is that the overall dimensions of the two packages are basically the same. So, what is the difference between the two packages?

1、 Height. The packaging height of the Youfeng micro diode SMA is 2.2mm; The height of the SMAF packaged diode is 1.0mm.

2、 Pin. The diode SMA packaging pins are bent; The diode SMAF is packaged as a flat mount device at the bottom.

3、 Advantages.

A. Substitution: The diode SMAF packaging can completely replace all specifications of SMA without changing the circuit design and PCB board

B. Ultra thin: 50% reduction in thickness compared to existing SMA (from 2.2mm to 1.0mm); The optimized design of electrodes provides better heat dissipation performance; Foot extension design to avoid false soldering; The use of flat process chips significantly improves their high-temperature reliability.

C. The chip packaging covers all types of planar diodes: ranging in size from 24MIL to 70MIL, laying the foundation for the miniaturization and application of ultra-low forward VF series diodes in the next step.

D. Good heat dissipation: low thermal resistance, high junction temperature, high surge resistSMAnce design, flat lead device bottom, short heat dissipation path, achieving technological breakthroughs in small volume and high power.

E. High cost-effectiveness: The cost of SMAF packaged diodes has moved closer to that of SMA packaged diodes, achieving a breakthrough in high quality and cost-effectiveness.