What are the manufacturing processes for rectifying device chips?

What are the manufacturing processes for rectifying device chips?

The production process of rectifier diode rectifier bridge chips mainly includes acid washing method (OJ) and glass passivation (GPP)

What are the differences in the manufacturing processes of these tworectifier bridge chips?

The biggest difference between the two products lies in the protection of the P-N junction. Products with OJ structure are protected by adhesive coating and then cured at a temperature of around 200 degrees Celsius. Protect the P-N junction to obtain voltage.

The P-N junction of the chip is protected by passivated glass, which is sintered and melted at around 800 degrees Celsius to form a glass layer after cooling. This glass layer and chip are fused together and cannot be separated mechanically. The OJ process only involves coating the surface of the P-N junction with adhesive.