Abnormal situations may occur in the encapsulation adhesive of light-emitting diodes 1

Light emitting diode (LED) encapsulation adhesive usually refers to the medium between the LED chip and the external environment, used to fix and protect the LED chip. The abnormal situation of LED packaging adhesive may affect the performance and reliability of LED. The following are some possible abnormal situations and their possible reasons:diode

1. Bubbles: Bubbles in the encapsulation adhesive may be caused by uneven mixing, insufficient vacuum, or improper temperature control during the encapsulation process.diode

2. gel: incomplete setting of encapsulant may be caused by insufficient addition of curing agent or insufficient curing time.

3. Cracks: Cracks in the encapsulation adhesive may be caused by excessive internal stress, uneven temperature changes, or external forces.

4. Color change: The color change of the encapsulation adhesive may be caused by material oxidation, long-term exposure to light, or improper environmental conditions during use.diode

5. Insufficient stickiness: Insufficient stickiness of the encapsulation adhesive may result in the LED chip not being firmly fixed, affecting its DS26C32ATN heat dissipation performance and stability.diode

The following measures can be taken to address and improve these abnormal situations: