Date:2025-12-23 Categories:Product knowledge Hits:174 From:Guangdong Youfeng Microelectronics Co., Ltd
6、 Fault analysis:
Fault analysis usually involves the following aspects:
1. Forward conduction fault: If the diode cannot conduct under forward bias, it may be due to internal structural damage or solder joint failure.diode
2. Excessive reverse leakage current: If the leakage current of the diode exceeds the specification during reverse bias, it may be due to internal breakdown or surface contamination of the diode.diode
3. Extended reverse recovery time: If the reverse recovery time of a diode is longer than normal, it may be due to device aging or overheating damage.diode
4. Thermal runaway: When operating at high temperatures, if there is insufficient heat dissipation, the diode may overheat, resulting in decreased performance or even burnout.diode
7、 Development history:
The development of fast recovery diodes began in the 1950s, when the demand for high-speed switching devices in the electronics industry was increasing.diode
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