A Detailed Explanation of MEMS High-Temperature Pressure Sensors 1

The MEMS (Micro-Electro-Mechanical Systems) high-temperature pressure sensor is a pressure measurement device based on micro-nano technology, with extensive applications in industries such as automotive, aerospace, and chemical manufacturing. This article will provide a detailed introduction to the principles, structure, fabrication processes, advantages, and applications of MEMS high-temperature pressure sensors.diode

1. Principle

The MEMS high-temperature pressure sensor is fabricated using MEMS technology based on a silicon chip. It measures pressure by detecting the influence of pressure on the electrical performance of microstructures on the CD4093BM silicon chip. The fundamental principle is that when pressure acts on the microstructures of the silicon chip, these microstructures undergo elastic deformation, thereby altering their physical parameters such as resistance, capacitance, or vibration frequency. By measuring the changes in these physical parameters, the pressure value can be calculated.diode

II. Structure

MEMS high-temperature pressure sensors typically consist of a silicon chip, an encapsulation housing, and connecting pins. The silicon chip is the core component of the sensor, composed of a series of microstructures, thin films, and electrodes. The encapsulation housing protects the chip and provides the function of pressure transmission to the external environment. The connecting pins are used to interface the sensor with other circuits.diode