Changdian Technology assists in the manufacturing of Hall sensors for new energy vehicles, enhancing vehicle safety performance 2

Changdian Technology has a profound technical accumulation and rich manufacturing experience in the field of semiconductor packaging and testing. In the manufacturing process of Hall sensors, Changdian Technology adopts advanced packaging technologies such as QFN (Quad Flat No led Package) and BGA (Ball Grid Array), which not only meet the requirements of miniaturization and high performance of EP610DI-30 Hall sensors, but also improve the reliability and durability of products.diode

In addition, Changdian Technology has implemented a strict quality control system, meticulously monitoring and testing every aspect from raw material selection to production processes, ensuring the high quality and long-term stability of Hall sensor products. This is particularly important for the field of new energy vehicles, which have extremely high requirements for safety performance.diode

Changdian Technology's contributions in the field of Hall sensor manufacturing are mainly reflected in the following aspects:

1. Packaging Technology Innovation: Changdian Technology utilizes advanced packaging technologies such as QFN (Quad Flat No leads Package) and BGA (Ball Grid Array) packaging to provide a more compact and high-performance packaging solution for Hall sensors. These packages not only reduce the volume of sensors, but also improve their ability to withstand harsh environments, meeting the high reliability requirements of sensors for new energy vehicles.diode

2. Wafer Level Packaging (WLP): Changdian Technology uses wafer level packaging technology to directly package sensors on wafers and then cut them into independent devices. This technology further reduces the size and enhances the flexibility of Hall sensors, which is beneficial for integrating more functions in limited space.diode