Main considerations during packaging diodes
To improve diodes packaging efficiency, the ratio of chip area to packaging area should be as close as possible to 1:1;
2. The pins should be as short as possible to reduce latency, and the distance between pins should be as far as possible to ensure mutual interference and improve performance;
3. Based on heat dissipation requirements, the thinner the package, the better.
Contact: Emma Tan
Phone: +8613650089053
E-mail: emma@yfwdiode.com
Add: No.9 Cuibi street,Nancheng,Zhang mutou town,Dongguan City,Guangdong Province