What are the differences between the diode frame and the flattened external structure?

What are the differences between the diode frame and the flattened external structure?

There are differences in the appearance of diode packaging, so what is the difference between the frame and the flattened frame?

1、 The diode frame process products are directly formed by automated rib cutting, with 5 products formed in one go. The flattening process requires products to be flattened with leads and then cut into ribs, forming 50 pieces each time; Due to the inability of each flattening mold to be completely consistent, each mold may not necessarily reach the root every time, making it difficult to cut the ribs, which can easily lead to cracking of the body, skewed and asymmetric pins, inconsistent pin width, and even internal chip damage, resulting in excessive leakage current or positive impedance.

2、 When testing printing packaging with TMTT, the quality of frame process products is higher than that of flat process products in terms of yield and overall pass rate, indicating that the quality of frame products is ahead of flat products.

3、 The equipment for producing diode frame process products is relatively expensive; However, the yield of flattened products is relatively low. The price of TVS diode products of the same model produced by the frame process is slightly higher than that produced by the flattening process.