What are the points for attention in the use of rectifier diodes?

When the rectifier diode lead is formed and bent, the lead must be fixed and clamped with a clamp where the lead is bent, and the plastic sealing pipe body cannot be fixed and clamped, so as to prevent the mechanical stress from being directly applied to the joint of the diodee body and the lead.
1. When the rectifier diode lead is formed and bent, the lead must be clamped with a fixture where the lead is bent, and the plastic sealing pipe body must not be clamped, so as to prevent the mechanical stress from being directly applied to the combination of the diodee body and the lead.
2. The bending of rectifier diode leads must be carried out outside the 3mm of the diodee body.
Third, the bending angle of the rectifier diode lead should not be greater than 90 °, and the lead can not be bent repeatedly.
Fourth, cutting and forming tools can not damage the coating on the surface of the lead.
Fifth, the allowable welding heat resistance of the device is below 260 ℃ and the duration is not more than 10 seconds. Welding should be carried out at least above 2mm from the body. The soaking temperature does not exceed 260 ℃ and the time does not exceed 10 seconds.
6. When flux is necessary for PCB welding, please use neutral flux and carry out necessary cleaning to remove excess flux.
Seventh, when wave soldering, please set up a sufficient preheating zone, and the preheating time is recommended in the range of 30 seconds to alleviate the thermal shock.
8. JEDEC standard is recommended for reflow soldering conditions (preheating temperature is 125 ±25 ℃, preheating time is 120 ±30s, duration is 105 ±45s above 183 ℃, peak temperature is 235 ±5pm, duration is 1020s. The maximum temperature rising rate is 3 ℃ / s, and the cooling rate is 6 ℃ / s).
When soaking tin with electric soldering iron, the temperature of electric iron head shall not exceed 300 ℃, and the welding time should be less than 10 seconds. Metal tweezers are clamped between the soldering iron and the device to reduce the direct transfer of heat to the inside of the device.
Reflow soldering should be used for surface sticking devices, and the most commonly used welding methods are convection reflow, gas phase reflow and far infrared reflow. The reflow soldering process is divided into three stages: preheating, reflow soldering and cooling. JEDEC standard is recommended for reflow soldering conditions (preheating temperature is 125 ±25 ℃, preheating time is 120 ±30s, duration above 183 ℃ is 105 ±45s, peak temperature is 235 ℃, duration is 1020s. The maximum temperature rising rate is 3 ℃ / s, and the cooling rate is 6 ℃ / s).