Bridge ​TTF Packaging New Product

 Bridge TTF Packaging New Product

In order to solve more electronic circuit problems, a new TTF package has been launched, with the following features:

Features:

1. Halogen-free type

2. Built in glass passivation rectifier chip structure

3. Meet RoHS product requirements

4. Low power loss and high efficiency

5. High current capability

6. Plastic flame retardant grade 94V-0

7. This package can be shared with Pad Layout in Z4GP, TT, and LSB packages

Compared to MSB packaging, the frame is larger, the chip is larger, and the heat dissipation is more advantageous

The maximum current of TTF packaged products can reach 8A. TTF  Bridge belongs to SMD packaging  Bridge, which can directly replace GBU810 8A and 1000V rectifier  Bridge, perfectly replacing large plug-in and labor-intensive rectifier  Bridge such as GBL, GBP, and GBU!